Cooler Master TPC 800 (RR-T800-FLNN-R1)

Cooler Master TPC 800 (RR-T800-FLNN-R1)
Width: 134 mm, Purpose: processor, Heat sink material: copper, Height: 163 mm, Depth: 74 mm, Evaporative camera: 2, Weight: 826 g, Heat pipes: 6, Brand: Cooler Master, Socket: LGA1150
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Main
Brand
Cooler Master
Dimensions and weight
Depth
74 mm
Weight
826 g
Width
134 mm
Technical characteristics
Cooling
passive
Evaporative camera
2
Heat pipes
6
Heat sink material
copper, aluminum
Installing the expansion slot
 
Socket
AM2+, LGA1366, AM2, FM1, LGA2011, LGA1150, LGA1155, AM3+, AM3, LGA775, LGA1156
Stand and dimensions
Height
163 mm
General information
Purpose
processor
The description and technical specifications of the Cooler Master TPC 800 (RR-T800-FLNN-R1) are taken from official sources. In most cases, the manufacturer/developper reserves the right to change specifications of their products without notification, so, before you buy anything, we’d recommend you to verify parameters of interest with the seller. The price of the Cooler Master TPC 800 (RR-T800-FLNN-R1) is formed automatically based on sellers’ offers.

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