Xilence Dual Heatpipe Cooler (COO-XPRAM.HP.DUO)

Xilence Dual Heatpipe Cooler (COO-XPRAM.HP.DUO)
Width: 20 mm, Heat sink material: copper, Purpose: operative memory, Heat pipes: 2, Height: 153 mm, Depth: 10 mm, Brand: Xilence, Cooling: passive
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Main
Brand
Xilence
Dimensions and weight
Depth
10 mm
Width
20 mm
Technical characteristics
Cooling
passive
Heat pipes
2
Heat sink material
copper
Stand and dimensions
Height
153 mm
General information
Purpose
operative memory
The description and technical specifications of the Xilence Dual Heatpipe Cooler (COO-XPRAM.HP.DUO) are taken from official sources. In most cases, the manufacturer/developper reserves the right to change specifications of their products without notification, so, before you buy anything, we’d recommend you to verify parameters of interest with the seller. The price of the Xilence Dual Heatpipe Cooler (COO-XPRAM.HP.DUO) is formed automatically based on sellers’ offers.

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