Cooling: active air, Type: DDR3 DIMM, CAS Latency: 9T, The number of banks: Yes, Number of chips: 8, Capacity chipset: 1 GB, XMP profiles: Yes, Chipset type: 128Mx8, Supply voltage: 1.65 V, Timings: 9-11-9-27No offers
three-band (3 modules)
|Low profile module|
|Dimensions and weight|
|Number of chips|
|The number of banks|
The description and technical specifications of the Kingston HyperX T1 KHX2333C9D3T1FK3/3GX
are taken from official sources. In most cases, the manufacturer/developper reserves the right to change specifications of their products without notification, so, before you buy anything, we’d recommend you to verify parameters of interest with the seller. The price of the Kingston HyperX T1 KHX2333C9D3T1FK3/3GX is formed automatically based on sellers’ offers.